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期刊專利論文

2013年環(huán)氧膠美國專利目錄

來源：互聯(lián)網2016年01月14日

閱讀次數(shù)：次

2013年環(huán)氧膠美國專利目錄

	PAT. NO.	Title
01	8,648,154	Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition
02	8,642,709	Epoxy resin composition with reduced toxicity
03	8,637,593	Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
04	8,629,219	Epoxy resin compound, preparation method thereof, prepreg made therefrom, and copper cladded laminate made therefrom
05	8,624,343	Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device
06	8,623,942	Epoxy resin composition, curing agent, and curing accelerator
07	8,608,899	Heat-curing epoxy resin composition comprising an accelerator having heteroatoms
08	8,586,653	Curing of epoxy resin compositions comprising cyclic carbonates using mixtures of amino hardeners
09	8,585,272	Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
10	8,581,107	Halogen-free flame-retardant epoxy resin composition, and prepreg and printed circuit board using the same
11	8,569,442	Hydrogenation process for improving yield of hydrogenated bisphenol-A-based epoxy resin
12	8,541,512	Epoxy resin-based composition modified for impact resistance
13	8,536,284	N,N'-dimethyl secondary diamine polymer as epoxy resin curing agent
14	8,536,256	DOPO-derived flame retardant and epoxy resin composition
15	8,532,442	Optical waveguide-forming epoxy resin composition, optical waveguide-forming curable film, optical-transmitting flexible printed circuit, and electronic information device
16	8,531,044	Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition
17	8,519,067	Epoxy resin composition and semiconductor device
18	8,501,876	Glass printing ink or lacquer of epoxy resin, other resin and photoinitiator
19	8,501,323	Two-component composition for producing polyurethane gel coats for epoxy-resin and vinyl-ester resin composite materials
20	8,492,939	Fan motor using epoxy resin
21	8,486,518	Epoxy resin for prepreg, prepreg, and fiber-reinforced composite material and methods for production thereof
22	8,481,622	Soybean based epoxy resin and methods of making and use
23	8,481,244	Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film
24	8,470,936	Liquid epoxy resin composition for semiconductor encapsulation
25	8,470,918	Epoxy resin composition and semiconductor device
26	8,466,483	Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device
27	8,466,238	Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays
28	8,465,837	Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board
29	8,461,662	Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the same
30	8,450,498	Ionic liquid epoxy resin monomers
31	8,450,451	Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials
32	8,436,079	Weather-resistant epoxy resin system
33	8,431,654	Epoxy resin composition
34	8,431,653	Curing agent composition for epoxy resins and epoxy resin composition
35	8,426,547	Phosphorus-containing epoxy resin and method for synthesizing the same
36	8,426,504	Hardenable epoxy resin composition
37	8,421,249	Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
38	8,420,766	Biomass-derived epoxy resin composition
39	8,420,749	Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin
40	8,410,619	Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device
41	8,409,773	Epoxy carboxyl resin mixture hole blocking layer photoconductors
42	8,404,339	Prepreg containing epoxy resin with improved flexural properties
43	8,399,596	Epoxy resin compositions and process for preparing them
44	8,399,577	Curable epoxy resin composition
45	8,389,652	Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions
46	8,383,738	Epoxy resin composition, and prepreg and printed circuit board using the same
47	8,378,442	Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device
48	8,372,922	One component epoxy resin composition and motor or dynamo using the same
49	8,362,188	Flame-retardant hardner for epoxy resin and flame-retardant resin material comprising the same
50	8,362,115	Epoxy resin composition